The uniform modular design of the Furon® CDV manifold valve is ideally suited to support customized manifold configurations. The CDV Manifold is ideal for semiconductor process, high purity and corrosive chemical applications that require both a high Cv factor and minimum footprint.
The Furon® CDV Valve is offered in manual or pneumatic actuated 2-way and multi-turn configurations to meet a wide range of customer requirements. True 1/2" orifice combined with our patent-protected rolling diaphragm technology supports higher flow rates required by 300MM wafer process equipment.